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Chip Edgebanding Low Temperature Hot Melt Glue White Polypropylene PUR-XBB768

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Province/State: Jiangsu
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Chip Edgebanding Low Temperature Hot Melt Glue White Polypropylene PUR-XBB768

Chip Edgebanding Low Temperature Hot Melt Glue White Polypropylene PUR-XBB768

Moisture-curing reactive adhesive PUR-XBB768 ensures superior bonding strength and high-quality appearance in edgebanding applications. The quality of the edgebanding is increasingly becoming a key ...

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